Laser Technology Challenges Thin and Brittle Nonmetallic Materials
Laser as an advanced processing tool, has more and more widely in the industrial production plays a pivotal role. With the continuous development of green laser pointer technology, its by virtue of the processing quality, processing complexity, processing efficiency and clean environmental protection and other advantages, not only in the stainless steel, copper, alloy and other metal materials processing favored, but also in the glass , Ceramics, sapphire, semiconductor silicon wafers, PCB board and other non-metallic materials processing highlights the unique advantages.
In these applications, glass, sapphire or ceramic and other materials, the thickness is usually thin, the hardness is getting higher and higher, very fragile. In the processing requirements, the application usually requires the use of these fine brittle materials on the very precise cutting, drilling and even slotting and other processing, which makes the traditional milling, drilling, grinding and other mechanical processing technology is facing Great challenge, because the material is extremely thin and very brittle, any stress applied to the material during contact with the process, may lead to material fragmentation, the final scrapped. However, the challenges faced by traditional machining methods have brought more opportunities for non-contact laser pen processing.
Glass, ceramics, sapphire and other brittle non-metallic materials, precision machining, usually using ultra-fast laser. Ultrafast laser pulse duration is extremely short, in nanoseconds, picoseconds and even femtosecond, the role of moderate laser energy on the surface of the material, by breaking the material chemical bond to achieve the purpose of material removal, in this process, the laser energy It is too late to pass around the processing range, the process has ended, so the heat is almost negligible, the material does not produce thermal damage. With the application of these brittle materials in products such as LEDs, smart phones, wearable equipment, etc., blue laser pointer, Laser technology in the field of brittle materials continue to break through.
The unique performance of glass, sapphire and other brittle, transparent materials will enable it to gain ever-increasing use in consumer electronics, medical equipment, integrated circuits, construction, automotive, aerospace and other market segments. Especially in the smart phone, wearing equipment, led by consumer electronics products, the strengthening of glass and sapphire applications, will have a lot of room for growth. Therefore, the market for brittle materials, laser processing needs are very good.
While the market is demanding high demand from the market to reduce processing steps, reduce material waste and dry process and other factors continue to drive, is also a strong impetus to the laser manufacturers and laser system integrators to provide continuous discussion, asking them not only to provide Traditional mechanical processing alternatives, but also continue to enhance the overall performance of laser pointer processing solutions to the processing quality, product yield, processing speed and mass production has been a breakthrough.
